Green Electronics Manufacturing

(CRC Press: Boca Raton, FL) -- Going “green” is becoming a major component of the mission for electronics manufacturers worldwide. Although this goal seems simplistic, it poses daunting dilemmas. Green Electronics Manufacturing: Creating Environmental Sensible Products, by John X. Wang (CRC Press, 2012) provides you with a complete reference to design, develop, build, and install an electronic product with special consideration for it’s environmental impacts during its whole life cycle.

Wang discusses how to integrate the state-of-the-art technologies of finite element method (FEM) modeling, simulation, and testing to create environmentally sensible products that satisfy global environmental regulations, such as compliance to the UK regulation, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). He covers enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics. The book also explores risk engineering methodology and empowers practitioners with effective tools such as buckling analysis of tin whiskers.

With its emphasis on reducing parts, rationing materials, and reusing components to make products more efficient to build, green electronics intertwines today’s electronics with manufacturing strategies of global sourcing, concurrent engineering, and total quality. Implemented through product and process design, the process can help you achieve sustainability to support future generations and at the same time preserve natural resources. Green Electronics Manufacturing: Creating Environmental Sensible Products gives you the tools to create environmentally sensible products while maintaining electronics quality and reliability.

Features

• Includes a systems engineering approach to help implement green electronics manufacturing
• Addresses thermal and vibration analysis of green electronic products
• Covers proactive reliability engineering and risk management of green electronic products
• Presents advanced modeling analysis of green electronic systems
• Discusses methods for green electronic circuit analysis

Contents

Green Electronic Assembly: Strategic Industry Interconnection Direction
Tin Whiskers: New Challenge for Long-Term RoHS Reliability
Fatigue Characterization of Lead-Free Solders
Lead-Free Electronic Reliability: Finite Element Modeling
Lead-Free Electronic Reliability: Fatigue Life Model
Lead-Free Electronic Reliability: Higher Temperature
Fatigue Design of Lead-Free Electronics and Weibull Distribution
Enhancing Reliability of Ball Grid Array
Finite Element Modeling Under High-Vibration and High-Temperature Environments
Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys
Flip-Chip Assembly for Lead-Free Electronics
Flip-Chip Bonding Technique for Lead-Free Electronics
Flip-Chip Bonding of Opto-Electronic Integrated Circuits
Let’s Package a Lead-Free Electronic Design

About John X. Wang

John X. Wang, a reliability engineer and a Six Sigma Master Black Belt, has taught design for Six Sigma training courses and led design for Six Sigma programs and projects for Maytag, Visteon, and General Electric. Wand has authored several books including Lean Manufacturing: Business Bottom-Line Based (CRC Press, 2010),  What Every Engineer Should Know About Business Communication (CRC Press, 2008), Engineering Robust Designs with Six Sigma (Prentice Hall, 2005), What Every Engineer Should Know About Decision Making Under Uncertainty (CRC Press, 2002), and What Every Engineer Should Know About Risk Engineering and Management (CRC Press, 200), all which you can view here.

About The Author