Featured Product
This Week in Quality Digest Live
Operations Features
Sara Adams
Here’s how you can avoid making them
Torsten Schimanski
Benefits to students, employers, and industries do more than address the skills gap
Eliot Dratch
Responding to the organization in the mirror
Lauren Dunford
Four steps for any factory to unlock big wins with digital tools
Matt Mong
Don’t look to ERP to handle project-based products

More Features

Operations News
The reshoring move will simplify operations
Additional option for interfacing and controlling innovative mobile surface measurement system cuts implementation costs in half
Is the future of quality management actually business management?
Features high-resolution, high-color contrast display to mimic smooth motion of an analog meter
Featuring 96 × 72 × 36 in., five-axis work envelope ideal for large-part welding, drilling, and cutting processes
First trial module of learning tool focuses on ISO 9001 and is available now
Automotive test bench supports brake hydraulic pressure and electric parking brake systems R&D

More News

Quality Digest

Operations

Siemens Announces New JEDEC Industry Standard For Electronics Cooling Simulation

JEP181 standard is ideal for emerging technologies that demand increased power dissipation density

Published: Tuesday, July 6, 2021 - 12:00

(Siemens: Plano, TX) -- Siemens Digital Industries Software announces the establishment of JEP181—a neutral file, XML-based standard from the JEDEC Solid State Technology Association, which is the global leader in standards development for the microelectronics industry.

The JEP181 standard simplifies thermal model data sharing between suppliers and end users in a single file format called ECXML (Electronics Cooling eXtensible Markup Language).

The new standard was created to meet a significant challenge for electronics manufacturers: as increasingly powerful processors allow companies to pack more performance and functionality into their designs, the effective management of heat dissipation and other thermal factors has become essential to the successful design of their next-generation electronics products. Advanced electronics cooling simulation technologies enable the creation of highly accurate thermal models of new product designs. But the absence of a uniform format for the exchange of thermal simulation data throughout supply chains has created unnecessary duplication of effort and the potential introduction of errors into the stream.

Proposed through the JEDEC JC15 committee, the new JEDEC JEP181 standard simplifies thermal model data sharing. With this universal thermal model sharing standard, electronics manufacturers can reduce the time required to simulate and validate their thermal models.

“The JEP181 standard from JEDEC benefits thermal design engineers by providing wider availability of the key data necessary to validate the thermal performance of today’s advanced designs,” states Ghislain Kaiser, senior director, Intel Corp. “This standardized format will allow more interoperability between engineering teams, leading to substantial time and cost savings by removing design barriers previously common in thermal engineering.”

JEDEC standard screen shot

Thermal model data availability and sharing is one of the key limiting factors in capitalizing on the benefits of thermal simulation throughout the product design process. Countless hours spent on mining product data sheets for thermal information, or re-implementing 2D engineering drawings within thermal simulation tools, can now be replaced by seamlessly importing commercial 3D simulation tools from software suppliers. The JEP181 standard is ideal for emerging technologies and trends such as miniaturization, 2.5D and 3D semiconductor packaging, and 5G technology—all of which demand increased power dissipation density.

“As a leader in industrial software solutions, our contribution to the new JEP181 standard can help drive the digitalization of design data to reduce both time and errors for today’s innovative electronics products,” states Jean-Claude Ercolanelli senior vice president of Simulation and Test Solutions, Siemens Digital Industries Software. “Enabling a seamless digitalized software flow can radically increase the efficiency and accuracy of thermal simulation and thus, enhance the performance and reliability of digital twin prototypes and manufactured products.”

More information on the JEDEC JEP181 standard is available here. Additional information on Siemens involvement and its offerings is available here.

Discuss

About The Author

Quality Digest’s picture

Quality Digest

For 40 years Quality Digest has been the go-to source for all things quality. Our newsletter, Quality Digest, shares expert commentary and relevant industry resources to assist our readers in their quest for continuous improvement. Our website includes every column and article from the newsletter since May 2009 as well as back issues of Quality Digest magazine to August 1995. We are committed to promoting a view wherein quality is not a niche, but an integral part of every phase of manufacturing and services.