Featured Product
This Week in Quality Digest Live
Innovation Features
Jennifer Chu
High-speed experiments help identify lightweight, protective ‘metamaterials’
Michael King
Augmenting and empowering life-science professionals
Rich Nobliski
Helping narrow the manufacturing skills gap with 3D tech
NIST scientists perfect miniaturized technique
Kristi McDermott
Technology and what the future requires for patients and providers to thrive

More Features

Innovation News
New tool presents precise, holistic picture of devices, materials
Enables better imaging in small spaces
Helping mines transform measurement of blast movement
Handles materials as thick as 0.5 in., including steel
For companies using TLS 1.3 while performing required audits on incoming internet traffic
Accelerates service and drives manufacturing profitability
Process contains leaks, improves thermal performance in buildings
Delivered by SpaceX launch to demonstrate in-space capabilities
Recognized among early adopters as a leading innovation for the life sciences industry

More News

Quality Digest


Ansys, TSMC, and Microsoft Speed Mechanical Stress Simulation for 3D-IC

High-capacity solution using TSMC’s 3DFabric technologies

Published: Monday, December 11, 2023 - 12:00

(Ansys: Pittsburgh) -- Ansys has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems manufactured with TSMC’s 3DFabric advanced packaging technologies. This team effort gives customers added confidence to address novel multiphysics requirements that improve the functional reliability of advanced designs using TSMC’s 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

Ansys Mechanical is an industry-leading finite element analysis software used to simulate mechanical stresses caused by thermal gradients in 3D-ICs. The solution flow has been proven to run efficiently on Microsoft Azure, helping to ensure fast turnaround times with today’s large and complex 2.5D/3D-IC systems.

3D-IC systems often have large temperature gradients that lead to intense mechanical stresses between components due to differential thermal expansion. These stresses can lead to cracking or shearing of the connections between various elements and reduce the reliable life span of a 3D-IC assembly. As the size and complexity of semiconductor systems grows, it becomes more difficult to analyze them efficiently. Ansys Mechanical, running on Azure’s purpose-built HPC infrastructure, is instrumental in scaling up computationally demanding stress simulations while maintaining predictive accuracy. By automating highly complex thermomechanical stress simulations, Ansys Mechanical can simulate massive models due to a highly efficient hybrid parallel solver that supports cost-effective computing by using on-demand cloud computing resources like Azure.

“In the face of design challenges brought by the growing size and complexity of semiconductor systems, the accurate analysis results become critical for the 3D-IC design using TSMC’s latest 3DFabric technologies,” says James Chen, director of 3D-IC integration division, TSMC. “Our latest collaboration with Ansys and Microsoft will benefit designers with Ansys Mechanical on Microsoft Azure, performing simulations faster without sacrificing accuracy to ensure high-quality 3D-IC designs for the next generation AI, HPC, mobile, and networking applications.”

“With this valuable collaboration between Ansys, Microsoft, and TSMC, our innovative solutions address novel multiphysics challenges and accelerate time to market while mitigating the risk of costly field failures in 3D-ICs due to thermomechanical stresses,” says John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Our joint customers and partners see increased value in Ansys’ open ecosystem approach, ensuring they can choose the best-in-class solutions and take advantage of our cloud-ready solvers with ease.”

“Microsoft and Ansys have collaborated to provide optimized cloud solutions for some of the biggest semiconductor design challenges with Microsoft Azure’s cloud resources and on-demand elastic compute capabilities,” says Merrie Williamson, corporate vice president of Azure infrastructure and digital and application innovation, Microsoft. “And with this close collaboration with TSMC, we have been able to create a leading-edge solution flow that is made possible by cloud technology.”


About The Author

Quality Digest’s picture

Quality Digest

For 40 years Quality Digest has been the go-to source for all things quality. Our newsletter, Quality Digest, shares expert commentary and relevant industry resources to assist our readers in their quest for continuous improvement. Our website includes every column and article from the newsletter since May 2009 as well as back issues of Quality Digest magazine to August 1995. We are committed to promoting a view wherein quality is not a niche, but an integral part of every phase of manufacturing and services.